New chip-packaging facility could save TSMC’s Arizona fab from “paperweight” status
New chip-packaging facility could save TSMC’s Arizona fab from “paperweight” status
arstechnica.com New chip-packaging facility could save TSMC’s Arizona fab from “paperweight” status
Apple will be "first and largest customer" at new $2 billion packaging facility.
![New chip-packaging facility could save TSMC’s Arizona fab from “paperweight” status](https://lemdro.id/pictrs/image/2a41d8db-4293-4830-a019-f746e67fc175.jpeg?format=webp&thumbnail=256)
0
comments