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3D X-DRAM aims for 10x capacity of today's memory — NEO Semiconductor's memory has up to 512 Gb per module

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3D X-DRAM aims for 10x capacity of today's memory — NEO Semiconductor's memory has up to 512 Gb per module

1 comments
  • Good to hear that they will be running proof of concept test in 2026.

    While it's difficult to evaluate such announcements, it seems that there is at least some potential for a breakthrough. Although I am surprised current DRAM leaders haven't gotten in touch with NEO Semiconductor (or started their own research initiatives in this direction).